About US

OEM/ODM SUPPLIER

Company Profile

HaiRongXin Co., Ltd. is an innovative technology enterprise integrating R&D, production, sales and brand operation. We have industry experience, technology and talent reserves, we integrate the superior resources of the industry, and focus on NAND FLASH storage series products, providing customers with more reliable storage application solutions. At present, our storage products have covered the needs of different performance levels such as consumer grade, commercial grade and industrial grade, and are widely used in security monitoring, recorders, game consoles, cameras, drones and other major industrial and consumer fields. So far, our products have been recognized and supported by many customers, and have obtained a number of authoritative certifications at home and abroad.

Semiconductor substrates specially used for manufacturing memory chips such as DRAM and NAND Flash. They are based on high-purity single crystal silicon (or new compound materials). The mainstream diameter is 300mm. The surface is formed by nanoscale photolithography and etching to form a multi-layer 3D stacked structure. Core parameters include process node (10-20nm level), memory cell density (≥1Gb/mm²) and dielectric layer uniformity (fluctuation ≤2%). Its manufacturing requires precise control of the charge trap layer and tunneling oxide film thickness (Angstrom level) to meet the high-bandwidth storage needs of data centers, consumer electronics and AI terminals. Representative manufacturers include Samsung, Micron and Yangtze Memory. The technology trend focuses on QLC NAND and HBM wafer-level integration.

All products are original designs, certified by CE, RoHS, FCC, ISO 9001, and have obtained multiple new patent certficates.

A controlled environment specially designed for micron-level manufacturing. The core parameters include constant temperature (±0.1℃), humidity (45±5%RH), air cleanliness (ISO level 1) and foundation vibration suppression (≤2μm/s). Equipped with a photolithography machine (overlay accuracy <3nm), a five-axis nanomachining center (surface roughness Ra <10nm) and a vacuum coating system, integrated laser interferometer (resolution 0.1nm) and AI visual inspection (defect recognition rate ≥99.97%). Applications cover wafer packaging, MEMS sensor manufacturing and aerospace optical component processing. It implements ISO 14644-1/ASME B89 standards and achieves full-process sub-micron quality control through coordinate measurement (CMM) and white light interferometry.

As an outstanding local technology enterprise, our company frequently accepts customs AEO qualification audits, strictly implements ECCN code verification and data cross-border security review, holds patent pool customs registration (H.S. code 8542.31), ensures the compliance of wafer imported photoresist hazardous chemicals, and has passed ISO 17025 cross-border logistics traceability certification.

Our company cooperates with 12 primary and secondary schools to carry out a RISC-V development board donation plan, opens a semiconductor science summer camp (covering 3,000+ primary and secondary school students every year), supports EDA tool chain training and tape-out subsidies, has been awarded the IEEE STEM education certification, and technical backbones regularly serve as judges for youth science and technology competitions.